The silicone coated fabric is a double-sided silicone tape coated with a reusable silicone compound and heat resistive silicone adhesive. It is specifically designed to temporarily fix FPC or tiny components to carrier jig during SMT processing. Easy-to-clean silicone coated fabric is cost-effective due to its reuse even in high temperature environments.
- Excellent dimensional stability at high temperature
- (No distortion, shrinkage/expansion at 260℃ continuous usage condition.)
- Superior adhesion and holding power of silicone adhesive
- No adhesive residue after removal
- Longer life time of silicone resin side
- Easy cleaning using cleaning roller allows extended lifetime
- Good surface flatness allows the whole area of FPC to be fixed
- Adhesion level of silicone compound can be controlled for customer’s requirement
Description
Physical Properties
| Property | Specification |
|---|---|
| Thickness | 1 mm |
| Total Weight | 1500 g/m² |
| Weight of Fiberglass Fabric | 852 g/m² |
| Coating | Double-side silicone coated |
| Tensile Strength (N/5 cm) | Warp: ≥5500Weft: ≥5000 |
| Width | 1.5 m |
| Operating Temperature Range | –50 ~ 250 ℃ |
Processing Advantages
- Excellent cut & die-cut properties
- Easy fixing and easy removal
- Provides flexibility for carrier design
Applications
1. SMT Process
- Reflow Soldering of FPC, Thin Rigid PCB & Rigid-flex PCB, etc
2.Assembly Process (including curing, wire bonding, etc)
- MEMS Microphone
- Camera Module, Vibration Motor
- Wireless LAN Module, GPS Module
- RF Module
- Accelerometer Sensor, Gyro Sensor
- Humidity Sensor, Temperature Sensor, etc.
- Flip Chip Mounting Process
- Flip Chip Mounting
3.LED Packaging Process
- LED Chip Bonding, Wire Bonding, Molding, etc.
4.Display Panel Process
- Carrier of LCD Panel, OLED Panel
- Temporary Fixing of Touch Panel
- Detaching Protection Films from LCD Panel or Polarizing Film
- Probe Station
- Fixing of Electrostatic Chuck
5.Substrate Manufacturing Process
- Dicing of LTCC, CSP or Inductor substrates
- MLCC Termination
- Micro-polishing of Thin Package Substrate